Semiconductor Devices, Transistors, and Methods of Manufacture Thereof

ABSTRACT

Semiconductor devices, transistors, and methods of manufacture thereof are disclosed. In one embodiment, a semiconductor device includes a gate dielectric disposed over a workpiece, a gate disposed over the gate dielectric, and a spacer disposed over sidewalls of the gate and the gate dielectric. A source region is disposed proximate the spacer on a first side of the gate, and a drain region is disposed proximate the spacer on a second side of the gate. A metal layer is disposed over the source region and the drain region. The metal layer extends beneath the spacers by about 25% or greater than a width of the spacers.

BACKGROUND

Semiconductor devices are used in a variety of electronic applications,such as personal computers, cell phones, digital cameras, and otherelectronic equipment, as examples. Semiconductor devices are typicallyfabricated by sequentially depositing insulating or dielectric layers,conductive layers, and semiconductive layers of material over asemiconductor substrate, and patterning the various material layersusing lithography to form circuit components and elements thereon.

The semiconductor industry continues to improve the integration densityof various electronic components (e.g., transistors, diodes, resistors,capacitors, etc.) by continual reductions in minimum feature size, whichallow more components to be integrated into a given area. These smallerelectronic components can introduce challenges into manufacturingprocess flows for semiconductor devices.

Transistors are elements that are fundamental building blocks ofelectronic systems and integrated circuits (ICs). Transistors arecommonly used in semiconductor devices to amplify and switch electronicpower and perform other operations. In semiconductor devices, silicidematerials are often used to reduce resistances of portions oftransistors, such as gates, sources, and drains.

What are needed in the art are improved transistor designs andmanufacturing methods for semiconductor devices.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present disclosure, and theadvantages thereof, reference is now made to the following descriptionstaken in conjunction with the accompanying drawings, in which:

FIGS. 1 through 6 show cross-sectional views of a method ofmanufacturing a transistor of a semiconductor device at various stagesin accordance with an embodiment of the present disclosure;

FIG. 7 is a more detailed view of FIG. 6, illustrating angles ofportions of spacers of the transistor in accordance with an embodiment;

FIG. 8 is a cross-sectional view of the transistor shown in FIG. 7 aftera metal layer comprising a silicide material is formed on the gate,source region, and drain region of the transistor in accordance with anembodiment;

FIG. 9 illustrates a resist protection oxide (RPO) formed on anon-silicide region of a workpiece of the semiconductor device inaccordance with an embodiment;

FIG. 10 is a cross-sectional view of a semiconductor device illustratinga transistor in accordance with another embodiment; and

FIG. 11 is a flow chart illustrating a method of manufacturing asemiconductor device in accordance with an embodiment of the presentdisclosure.

Corresponding numerals and symbols in the different figures generallyrefer to corresponding parts unless otherwise indicated. The figures aredrawn to clearly illustrate the relevant aspects of the embodiments andare not necessarily drawn to scale.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

The making and using of the embodiments of the present disclosure arediscussed in detail below. It should be appreciated, however, that thepresent disclosure provides many applicable inventive concepts that canbe embodied in a wide variety of specific contexts. The specificembodiments discussed are merely illustrative of specific ways to makeand use the disclosure, and do not limit the scope of the disclosure.

Embodiments of the present disclosure are related to semiconductordevices and transistors. Novel methods of manufacturing semiconductordevices and transistors and structures thereof will be described herein.

FIGS. 1 through 6 show cross-sectional views of a method ofmanufacturing a transistor 130 (see FIG. 8) of a semiconductor device100 at various stages of manufacturing in accordance with an embodimentof the present disclosure. Referring first to FIG. 1, there is shown across-sectional view of a semiconductor device 100. To manufacture thesemiconductor device 100, a workpiece 102 is provided. The workpiece 102may include a semiconductor substrate comprising silicon or othersemiconductor materials and may be covered by an insulating layer, forexample. The workpiece 102 may also include other active components orcircuits, not shown. The workpiece 102 may comprise silicon oxide oversingle-crystal silicon, for example. The workpiece 102 may include otherconductive layers or other semiconductor elements, e.g., transistors,diodes, etc. Compound semiconductors, GaAs, InP, Si/Ge, or SiC, asexamples, may be used in place of silicon. The workpiece 102 maycomprise a silicon-on-insulator (SOI) or a germanium-on-insulator (GOI)substrate, as examples.

A gate dielectric material 104 is formed over the workpiece 102, asshown in FIG. 1. The gate dielectric material 104 may comprise SiO₂,SiO_(x), SiN, other dielectric materials, or combinations or multiplelayers thereof formed by chemical vapor deposition (CVD) or othermethods. A gate material 106 is formed over the gate dielectric material104, also shown in FIG. 1. The gate material 106 may comprise dopedsilicon or other semiconductive materials deposited by CVD or othermethods. Alternatively, the gate dielectric material 104 and the gatematerial 106 may comprise other materials and may be formed using othermethods. The gate 106 and gate dielectric 104 each comprise a thicknessof a predetermined amount as a function of properties of the transistor130 desired.

The gate material 106 and the gate dielectric material 104 are patternedusing a photolithography process, forming a gate dielectric 104 and gate106 of a transistor, as shown in FIG. 2. For example, a layer ofphotoresist (not shown) may be formed over the gate material 106 shownin FIG. 1, and the layer of photoresist is patterned by transmittinglight or energy through or reflected from a lithography mask (also notshown) towards the layer of photoresist. Exposed (or unexposed,depending on whether a positive or negative photoresist is used)portions of the layer of photoresist are developed and then ashed oretched away. The patterned layer of photoresist is used as an etch maskwhile portions of the gate material 106 and the gate dielectric material104 are etched away, leaving the gate 106 and gate dielectric 104 shownin FIG. 2. The remaining layer of photoresist is then removed.Alternatively, a direct patterning method may be used to pattern thegate material 106 and the gate dielectric material 104, as anotherexample. The gate 106 and gate dielectric 104 have a width of apredetermined amount and extend in and out of the paper by apredetermined amount, depending on properties of the transistor 130desired. In some embodiments, offset spacers may be formed in sidewallsof the gate 106 and gate dielectric 104, to be described further herein.

A spacer material 112 is formed over the workpiece 102 over the topsurface of the gate 106, over sidewalls of the gate 106 and the gatedielectric 104, and over exposed portions of the workpiece 102, as shownin FIG. 3. The spacer material 112 may comprise about 500 nm or less ofan insulating material, such as SiO_(x), SiN_(x), SiO_(x)N_(y), otherinsulating materials, or combinations or multiple layers thereof, asexamples, although alternatively, the spacer material 112 may compriseother materials and dimensions.

A first etch process 114 is used to remove portions of the spacermaterial 112 from the top surface of the workpiece 102 and the topsurface of the gate 106, as shown in FIG. 4, leaving spacers 112disposed on sidewalls of the gate 106 and the gate dielectric 104. Thefirst etch process 114 may comprise an anisotropic etch process that isadapted to etch away more of the spacer material 112 from top surfacesof the workpiece 102 and the gate 106, leaving spacers 112 on sidewallsof the gate 106 and gate dielectric 104, as shown in FIG. 4.

An implantation process 116 is used to form source and drain regions 118a and 118 b proximate the spacers 112, as shown in FIG. 5. Theimplantation process 116 comprises implanting dopant ions into theworkpiece 102 proximate the spacers 112. The type of dopant ions usedare a function of the type of transistor 130 to be formed, e.g., ap-channel metal oxide semiconductor (PMOS) device or an n-channel MOS(NMOS) device. The transistor 130 (see FIGS. 7 and 8) can alternativelyinclude lightly doped drain (LDD) regions (not shown) formed in theworkpiece 102 prior to forming the spacers 112. The implantation process116 may comprise subsequently implanting a heavily doped impuritydistribution, to form source and drain region 118 a and 118 bimplantation regions, as will be familiar to those skilled in the fieldof semiconductor device processing, for example. The workpiece 102 mayoptionally be heated or annealed to drive the dopants deeper into theworkpiece 102, as shown in phantom in FIG. 5.

The source region 118 a is formed proximate the spacer 112 on a firstside (e.g., on the left side of the gate 106 in the drawings) of thegate 106. A drain region 118 b is formed proximate the spacer 112 on asecond side (e.g., on the right side of the gate 106 in the drawings) ofthe gate 106 that is opposite the first side of the gate 106. Region 118a is labeled as a source region, and region 118 b is labeled as a drainregion in the figures; alternatively, region 118 a may comprise a drainregion and region 118 b may comprise a source region, as examples.

After the implantation process 116, a portion of the spacers 112 isremoved using a second etch process 120, as shown in FIG. 6, formingreshaped spacers 112′. The portion of the spacers 112 removed includes atop portion of the spacers 112 on the top surface 122 of the spacers112. The portion of the spacers 112 removed also includes a portion ofthe spacers along sidewalls 124 of the spacers 112. The portion of thespacers 112 removed may also include a portion of the outer corners orshoulders of the spacers 112. The amount of material removed from thespacers 112 depends on the desired shape of the reshaped spacers 112′,the type of etch process 120 used, parameters of the etch process 120,the type of material of the spacers 112′, and other variables, asexamples.

The etch process 120 is used to reshape the spacers 112′ to improve ametal layer 126 formation process (not shown in FIG. 6; see metal layer126 shown in FIG. 8, to be described further herein). Removing theportion of the spacers 112 comprises reshaping the spacers 112′, forexample. The etch process 120 may comprise a dry etch process or a wetetch process, as examples. A masking material is not used during theetch process 120 of the spacers 112′ in some embodiments. The etchprocess 120 comprises a “spacer push” process in other embodiments, forexample.

In some embodiments, the source and drain regions 118 a and 118 b areformed using an implantation process, after the etch process 120 used toreshape the spacers 112 and form the reshaped spacers 112′.

FIG. 7 is a more detailed view of FIG. 6, illustrating angles α and β ofspacers 112′ of the transistor 130 in accordance with an embodiment.Removing the portion of the spacers 112 using the etch process 120comprises increasing an angle α of a top surface 122 of the spacers 112′with respect to a sidewall of the gate 106, in a region of the spacer112′ proximate the sidewall of the gate 106 (e.g., at a region of thespacer 112′ proximate the top surface 122 of the spacer 112′). The angleα of the spacers 112′ is an angle of a shoulder of the spacer 112′, forexample. The angle α between the top surface 122 of the spacers 112′ andthe sidewall of the gate 106 comprises about 90 to 95 degrees proximatethe sidewall of the gate 106 in accordance with some embodiments, forexample.

Furthermore, removing the portion of the spacers 112 using the etchprocess 120 comprises decreasing an angle β of a sidewall 124 of thespacers 112′ with respect to a top surface of the workpiece 102,proximate the top surface of the workpiece 102 (e.g., at a region of thespacers 112′ proximate the top surface of the workpiece 102). Removingthe portion of the spacers 112 comprises undercutting a lower portion125 of the spacers 112′ proximate the top surface of the workpiece 102in some embodiments, for example, shown in phantom in FIG. 7. The angleβ of the spacers 112′ is an angle of the footing of the spacer 112′, forexample. The angle β between the sidewall 124 of the spacers 112′ andthe top surface of the workpiece 102 comprises less than about 90degrees proximate the top surface of the workpiece 102, for example, insome embodiments.

FIG. 8 is a cross-sectional view of the transistor 130 shown in FIG. 7after a metal layer 126 has been formed on the top surfaces of the gate106 and the source and drain regions 118 a and 118 b of the transistor130. The metal layer 126 comprises a silicide in some embodiments, forexample. The metal layer 126 is formed over the source region 118 a, thedrain region 118 b, and the gate 106 using a silicidation process. Themetal layer 126 may comprise Ni, Ti, Co, other metals, or combinationsthereof, as examples. The metal layer 126 is formed in some embodimentsby deposition using radio-frequency (RF) sputtering or physical vapordeposition (PVD), as examples. An annealing cycle, performed usingconventional furnace procedures or using a rapid thermal anneal (RTA)procedure is used to form the metal layer 126 comprising a silicidematerial, such as nickel silicide, titanium silicide, cobalt silicide,or other silicides on the exposed polysilicon or silicon surfaces of theworkpiece 102 and gate 106. The unreacted metal is then removed using asolution. The metal layer 126 results in a desired performanceenhancement of the transistor 130 due to the formation of the metallayer 126, such as reduced leakage current, reduced contact resistance,and other improved parameters of the transistor 130. The metal layer 126may alternatively comprise other materials and may be formed using othermethods.

The metal layer 126 may have a top surface that is curved in someembodiments, as shown in FIG. 8. The top surface of the gate 106 beforethe silicidation process may also be curved, as shown in phantom inFIGS. 7 and 8. The top surfaces of the metal layer 126 and gate 106 maycomprise a raised curve shape, for example.

The novel etch process 120 that is used to reshape the spacers 112 toform the reshaped spacers 112′ results in a metal layer 126 being formedin a subsequent process step over the source region 118 a and the drainregion 118 b, wherein the metal layer 126 extends beneath the spacers112′ by an amount comprising dimension x. Dimension x comprises about25% or greater than a width w of the spacers 112′ in some embodiments,for example, due the novel shape of the spacers 112′ formed by the etchprocess 120. The encroachment ratio of the metal layer 126 comprisesratio (x/w) of about 25% or greater, for example. In some embodiments,the encroachment ratio may comprise about 50 to 55%, as another example.The angles α and β of spacers 112′ and the undercut of the spacers 112′proximate the workpiece 102 top surface advantageously results in anincrease in the amount of silicide encroachment, forming an increaseddimension x of the metal layer 126 beneath the spacers 112′. The highencroachment ratio (x/w) of the metal layer 126 formed results inimproved performance of the transistor 130.

Note that only one transistor 130 is shown in the embodiments shown inFIGS. 1 through 8; however, a plurality of transistors 130 is typicallyformed across a surface of a workpiece 102 simultaneously. For example,in FIG. 9, two transistors 130 a and 130 b are shown formed on theworkpiece 102. Transistor 130 a may be formed in one region of theworkpiece 102, and transistor 130 b may be formed in another region ofthe workpiece 102, for example. Hundreds or thousands of the transistors130, 130 a, and 130 b described herein may be formed across the surfaceof the workpiece 102, depending on the semiconductor device 100 designand size, in accordance with embodiments of the present disclosure.

The etch process 120 that is used to reshape the spacers 112 and formthe reshaped spacers 112′ is advantageously performed after or beforethe implantation process 116 for the source and drain regions 118 a and118 b, yet before additional insulating material layers are formed overthe workpiece 102 over the transistors 130, in accordance withembodiments. As one example, the etch process 120 used to form thereshaped spacers 112′ is performed before a resist protection oxide(RPO) is formed on the workpiece 102 in some embodiments. The RPO mayoptionally be formed over the entire surface of the workpiece 102 afterthe etch process 120, and the RPO is then removed from portions of theworkpiece 102, as shown in FIG. 9, which illustrates an RPO 132 formedon a region of a workpiece 102 of the semiconductor device 100 inaccordance with an embodiment in a cross-sectional view. Transistor 130a comprises a transistor 130 a in which a metal layer 126 will be formedon the gate 126, source region 118 a, and drain region 118 b, andtransistor 130 b comprises a transistor 130 b in which a metal layer 126will not be formed. Transistor 130 a may reside in a peripheral logicregion or other type of region that requires silicidation in order toreduce contact resistance. Transistor 130 b may reside in a non-silicideregion, such as a main region for a memory matrix that does not requiresilicidation, as an example. Transistors 130 a and 130 b mayalternatively reside in other types of regions of the semiconductordevice 100.

The RPO 132 is formed over the entire workpiece 102, e.g., over bothtransistors 130 a and 130 b. The RPO 132 is then removed from overtransistor 130 a using a lithography process, leaving the structureshown in FIG. 9. Because the etch process 120 was used to reshape thespacers 112′ after the implantation process 116 rather than after theRPO 132 formation, a subsequent silicidation process (e.g., that is usedto form metal layer 126, as described for FIG. 8), is not deleteriouslyimpacted by the formation of the RPO 132 over the workpiece 102.

FIG. 10 is a cross-sectional view of a semiconductor device 100illustrating a transistor 130 in accordance with another embodiment.Before the spacer 112 is formed and reshaped to form the reshaped spacer112′, a first spacer 108 comprising an offset spacer is formed on thesidewalls of the gate 106 and the gate dielectric 104. The offset spacer108 comprises a similar material described for the spacer 112 materialand may be formed using similar methods as the spacer 112. The offsetspacer 108 may comprise the same material as, or a different materialthan, the spacer 112′, for example. The spacers 112′ comprise mainspacers that are formed on the sidewalls of the offset spacer 108 inthis embodiment. One of the offset spacers 108 is disposed between eachof the main spacers 112 and the sidewalls of the gate 106 and the gatedielectric 104. An implantation process or processes and annealprocesses may be performed before or after forming the offset spacer 108and/or the main spacers 112 or 112′ to form the source and drain regions118 a and 118 b, depending on the transistor 130 design, for example.The processing of the transistor 130 is then continued using similarprocessing steps that were described for the embodiment shown in FIGS. 1through 8.

FIG. 11 is a flow chart 140 illustrating a method of manufacturing asemiconductor device 100 in accordance with an embodiment. In step 142,a workpiece 102 is provided. In step 144, a gate dielectric 104 isformed over the workpiece 102. In step 146, a gate 106 is formed overthe gate dielectric 104. A spacer 112 is formed on sidewalls of the gate106 and the gate dielectric 104 in step 148. In step 150, a sourceregion 118 a is formed proximate the spacer 112 on a first side of thegate 106, and a drain region 118 b is formed proximate the spacer 112 ona second side of the gate 106, the second side being opposite the firstside. In step 152, a portion of the spacers 112 is removed, formingreshaped spacers 112′. In step 154, a metal layer 126 is formed over thesource region 118 a, the drain region 118 b, and the gate 106. The metallayer 126 disposed over the source region 118 a and the drain region 118b extends beneath the spacers 112′ by an amount x that is about 25% orgreater than a width w of the spacers 112′, as shown in FIG. 8.

After the transistors 130, 130 a, and 130 b are formed using themanufacturing methods described herein, additional material layers arethen deposited and formed over the transistors 130, 130 a, and 130 b tocomplete the manufacturing process for the semiconductor device 130. Forexample, one or more insulating materials and conductive material layersmay be formed over the transistors 130, 130 a, and 130 b, not shown.Contacts are formed in the insulating material layers to make electricalcontact to the gate 106 and source and drain regions 118 a and 118 bthat include the metal layer 126, for example, also not shown.

Embodiments of the present disclosure include methods of formingtransistors 130 and semiconductor devices 100. Embodiments of thepresent disclosure also include semiconductor devices 100 that includethe novel transistors 130 described herein.

Advantages of embodiments of the disclosure include providing novelsemiconductor devices 100 and transistors 130 wherein a metal layer 126formed over the source and drain regions 118 a and 118 b extends byabout 25% or more beneath spacers 112′ on sidewalls of the gate 106 andgate dielectric 104 material, providing improved transistors 130 withsource and drain regions 118 a and 118 b having reduced resistance andimproved operating performance. The undercut profile of the spacers112′, e.g., at the spacer 112′ footing, increases the encroachment ratioso that the metal layer 126 comprising the silicide regions extendsfurther beneath the spacers 112′.

Performing the etch process 120 used to reshape the spacers 112 and formreshaped spacers 112′ prior to the RPO 132 process shown in FIG. 9improves a process window for the metal layer 126 formation. Performingthe etch process 120 at this time in the manufacturing process flowprovides a more controllable spacer 112′ profile that enlarges thepolysilicon-to-polysilicon (poly/poly) space of the source and drainregions 118 a and 118 b of the transistors 130, 130 a, and 130 b.Enlarging the poly/poly space is particularly advantageous in advancedtechnologies wherein features sizes are reduced, for example.

The reshaped spacers 112′ result in increased silicon loss of theworkpiece 102 proximate the gate dielectric 104, e.g., comprising asilicon loss of about 3.5 nm in some applications after the silicideprocess, as an example. The reshaped spacers 112′ result in theformation of the metal layer 126 over the source and drain regions 118 aand 118 b that is deeper and wider, e.g., providing source and drainregions 118 a and 118 b that are wider beneath the spacers 112′ by about2 nm in some applications. Alternatively, the amount of silicon loss andincreased width of the source and drain regions 118 a and 118 b maycomprise other values.

The etch process 120 used to form the reshaped spacers 112′ also reducesroughness of the spacers 112′ caused by etch process 114 used to formthe spacers 112 and other previous processes. The etch process 120 formsspacers 112′ with a smoother profile, which further improves silicideformation. The novel semiconductor devices 100, transistors 130, 130 a,and 130 b, and manufacturing methods and designs described herein areeasily implementable in manufacturing process flows.

In accordance with one embodiment of the present disclosure, asemiconductor device includes a gate dielectric disposed over aworkpiece, a gate disposed over the gate dielectric, and a spacerdisposed over sidewalls of the gate and the gate dielectric. A sourceregion is disposed proximate the spacer on a first side of the gate, anda drain region is disposed proximate the spacer on a second side of thegate. A metal layer is disposed over the source region and the drainregion. The metal layer extends beneath the spacers by about 25% orgreater than a width of the spacers.

In accordance with another embodiment, a transistor includes aworkpiece, a gate dielectric disposed over a workpiece, and a gatedisposed over the gate dielectric. A spacer is disposed on sidewalls ofthe gate and the gate dielectric. A source region is disposed proximatethe spacer on a first side of the gate, and a drain region is disposedproximate the spacer on a second side of the gate, the second side ofthe gate being opposite the first side of the gate. A silicide materialis disposed over the source region, the drain region, and the gate. Thesilicide material disposed over the source region and the drain regionextends beneath the spacers by about 25% or greater than a width of thespacers.

In accordance with yet another embodiment, a method of manufacturing asemiconductor device includes providing a workpiece, forming a gatedielectric over the workpiece, and forming a gate over the gatedielectric. The method includes forming a spacer on sidewalls of thegate and the gate dielectric, forming a source region proximate thespacer on a first side of the gate, and forming a drain region proximatethe spacer on a second side of the gate, the second side being oppositethe first side. A portion of the spacers is removed, and a metal layeris formed over the source region, the drain region, and the gate. Themetal layer disposed over the source region and the drain region extendsbeneath the spacers by about 25% or greater than a width of the spacers.

Although embodiments of the present disclosure and their advantages havebeen described in detail, it should be understood that various changes,substitutions and alterations can be made herein without departing fromthe spirit and scope of the disclosure as defined by the appendedclaims. For example, it will be readily understood by those skilled inthe art that many of the features, functions, processes, and materialsdescribed herein may be varied while remaining within the scope of thepresent disclosure. Moreover, the scope of the present application isnot intended to be limited to the particular embodiments of the process,machine, manufacture, composition of matter, means, methods and stepsdescribed in the specification. As one of ordinary skill in the art willreadily appreciate from the disclosure of the present disclosure,processes, machines, manufacture, compositions of matter, means,methods, or steps, presently existing or later to be developed, thatperform substantially the same function or achieve substantially thesame result as the corresponding embodiments described herein may beutilized according to the present disclosure. Accordingly, the appendedclaims are intended to include within their scope such processes,machines, manufacture, compositions of matter, means, methods, or steps.

1.-9. (canceled)
 10. A method of manufacturing a semiconductor device,the method comprising: providing a workpiece; forming a gate dielectricover the workpiece; forming a gate over the gate dielectric; forming aspacer on sidewalls of the gate and the gate dielectric; forming asource region proximate the spacer on a first side of the gate; forminga drain region proximate the spacer on a second side of the gate, thesecond side being opposite the first side; removing a portion of thespacers; and forming a metal layer over the source region, the drainregion, and the gate, wherein the metal layer formed over the sourceregion and the drain region extends beneath the spacers by about 25% orgreater than a width of the spacers.
 11. The method according to claim10, wherein removing the portion of the spacers comprises reshaping thespacers.
 12. The method according to claim 10, wherein removing theportion of the spacers comprises a dry etch process or a wet etchprocess.
 13. The method according to claim 10, wherein removing theportion of the spacers comprises increasing an angle of a top surface ofthe spacers with respect to a sidewall of the gate, proximate thesidewall of the gate.
 14. The method according to claim 10, whereinremoving the portion of the spacers comprises decreasing an angle of asidewall of the spacers with respect to a top surface of the workpiece,proximate the top surface of the workpiece.
 15. The method according toclaim 14, wherein removing the portion of the spacers comprisesundercutting a lower portion of the spacers proximate the top surface ofthe workpiece.
 16. The method according to claim 10, wherein removingthe portion of the spacers comprises a spacer push process.
 17. Themethod according to claim 10, further comprising forming a resistprotection oxide (RPO) over a portion of the workpiece, and whereinremoving the portion of the spacers comprises etching the portion of thespacers before forming the RPO.
 18. The method according to claim 10,wherein forming the source region and forming the drain region comprisean implantation process, and wherein removing the portion of the spacerscomprises etching the portion of the spacers after the implantationprocess.
 19. The method according to claim 10, wherein forming thesource region and forming the drain region comprise an implantationprocess, and wherein removing the portion of the spacers comprisesetching the portion of the spacers before the implantation process. 20.The method according to claim 10, wherein removing the portion of thespacers does not comprise using a masking material.
 21. A method ofmanufacturing a semiconductor device, the method comprising: providing asubstrate; forming a gate dielectric over the substrate; forming a gateover the gate dielectric; forming a spacer on sidewalls of the gatedielectric and the gate; forming a source region proximate the spacer ona first side of the gate; forming a drain region proximate the spacer ona second side of the gate; removing a portion of the spacers, whereinremoving the portion of the spacers comprises a dry etch or a wet etch,and wherein no masking layer is used for removing the portion of thespacers; forming a silicide material over the source region, the drainregion, and the gate, wherein the silicide material formed over thesource region and the drain region extends beneath the spacers by about25% or greater than a width of the spacers; and forming a resistprotection oxide over at least a portion of the substrate, whereinforming the resist protection oxide is performed after removing theportion of the spacers.
 22. The method of claim 21, wherein the spacercomprises SiO_(x), SiN_(x), SiO_(x)N_(y), or a combination thereof. 23.A method of manufacturing a semiconductor device, the method comprising:providing a workpiece; depositing a gate dielectric layer over theworkpiece; depositing a gate layer over the gate dielectric layer;patterning the gate dielectric layer and the gate layer to form a gatedielectric and a gate, respectively; applying a spacer material overexposed portions of the workpiece, a top surface of the gate, andsidewalls of the gate dielectric and the gate; etching the spacermaterial to form spacers on the sidewalls of the gate dielectric and thegate; performing at least one implantation process to form a sourceregion proximate the spacer on a first side of the gate and a drainregion proximate the spacer on a second side of the gate; removing aportion of the spacers, wherein removing the portion of the spacerscomprises an etching process, and wherein no masking layer is used forremoving the portion of the spacers; forming a metal layer over thesource region, the drain region, and the gate, wherein the silicidematerial formed over the source region and the drain region extendsbeneath the spacers by about 25% or greater than a width of the spacers;and forming a resist protection oxide over at least a portion of thesubstrate, wherein forming the resist protection oxide is performedafter removing the portion of the spacers.
 24. The method of claim 23,further comprising forming offset spacers on the sidewalls of the gateand the gate dielectric, wherein the offset spacers are formed beforeapplying the spacer material.
 25. The method of claim 24, wherein thespacer material and the offset spacers comprise a same material.
 26. Themethod of claim 23, further comprising forming lightly doped drainregions in the workpiece, wherein forming the lightly doped drainregions is performed before the at least one implantation process. 27.The method of claim 23, further comprising heating the workpiece afterthe at least one implantation process to form the source region and thedrain region.
 28. The method of claim 23, wherein the etching processfor removing the portion of the spacers comprises a dry etch process ora wet etch process.
 29. The method of claim 23, wherein removing theportion of the spacers is performed before the at least one implantationprocess to form the source region and the drain region.